Thermal resistance research of power devices based on structural function curve correction method
This study investigated the thermal resistance of various layers within power devices. To this end, thermal resistance tests were conducted on an IGBT module, leading to the plotting of its structural function curve. This module was then structurally modeled, and subsequent transient thermal simulat...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | Chinese |
| Published: |
Editorial Department of Electric Drive for Locomotives
2025-03-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128X.2025.02.103 |
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