Enhanced thermal management in microelectronic cooling: A study on pairing multiple pin-fin shapes in microchannel heat sinks
In the last decade, microelectronics have advanced significantly, resulting in higher generated heat flux, which, if not managed carefully, may lead to damage or even failure. Pin-fin microchannels are one of the promising techniques that can be used to enhance heat dissipation. This study investiga...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-07-01
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| Series: | International Journal of Thermofluids |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666202725002307 |
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