APA (7th ed.) Citation

Ismailov, T. A., Gadjiyev, H. M., Chelushkina, T. A., & Chelushkin, D. A. (2016). INTENSIFICATION OF HEAT TRANSFER FROM THE IC CHIP TO THE HEAT SINK THROUGH THE USE OF NANOFILM THERMOELECTRIC HEAT PUMP. Dagestan State Technical University.

Chicago Style (17th ed.) Citation

Ismailov, T. A., H. M. Gadjiyev, T. A. Chelushkina, and D. A. Chelushkin. INTENSIFICATION OF HEAT TRANSFER FROM THE IC CHIP TO THE HEAT SINK THROUGH THE USE OF NANOFILM THERMOELECTRIC HEAT PUMP. Dagestan State Technical University, 2016.

MLA (9th ed.) Citation

Ismailov, T. A., et al. INTENSIFICATION OF HEAT TRANSFER FROM THE IC CHIP TO THE HEAT SINK THROUGH THE USE OF NANOFILM THERMOELECTRIC HEAT PUMP. Dagestan State Technical University, 2016.