Fabrication of Black Silicon With Thermostable Infrared Absorption by Femtosecond Laser

Annealing-insensitive black silicon with high absorption below the silicon bandgap has been achieved by femtosecond laser direct writing. Spike microstructures with sizes ranging from 4 to 25 μm are formed on the surface layer of silicon substrate, and a large amount of phospho...

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Bibliographic Details
Main Authors: Chun-Hao Li, Ji-Hong Zhao, Xin-Yue Yu, Qi-Dai Chen, Jing Feng, Hong-Bo Sun
Format: Article
Language:English
Published: IEEE 2016-01-01
Series:IEEE Photonics Journal
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Online Access:https://ieeexplore.ieee.org/document/7590103/
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Summary:Annealing-insensitive black silicon with high absorption below the silicon bandgap has been achieved by femtosecond laser direct writing. Spike microstructures with sizes ranging from 4 to 25&#x00A0;&#x03BC;m are formed on the surface layer of silicon substrate, and a large amount of phosphorous impurities (<inline-formula><tex-math notation="LaTeX"> $10^{21}\,{\rm{cm}}^{- 3}$</tex-math></inline-formula>) is doped during the resolidification process. The infrared absorption of phosphorus-doped black silicon decreases slightly with both the annealing temperature and duration. Excitingly, the largest decrease is less than 10&#x0025; at 2&#x00A0;&#x03BC;m (annealing 240&#x00A0;min at 873K). This thermostable infrared absorption is related to free carrier absorption. After laser irradiation, the phosphorus-doped layer maintains a relatively high crystallinity that can be improved further during thermal annealing. The density of the electrically activated impurities is approximately <inline-formula><tex-math notation="LaTeX"> $10^{19}\,{\rm{cm}}^{- 3}$</tex-math></inline-formula>.
ISSN:1943-0655