High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated Circuits
In this work we report the results of high density multi-channel optical multiprobes with pitches of 25 <inline-formula><tex-math notation="LaTeX">${\mu }\rm{m}$</tex-math></inline-formula> and 50 <inline-formula><tex-math notation=&qu...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2021-01-01
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| Series: | IEEE Photonics Journal |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9296295/ |
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| Summary: | In this work we report the results of high density multi-channel optical multiprobes with pitches of 25 <inline-formula><tex-math notation="LaTeX">${\mu }\rm{m}$</tex-math></inline-formula> and 50 <inline-formula><tex-math notation="LaTeX">${\mu }\rm{m}$</tex-math></inline-formula> that provide edge-coupling used for on-wafer parallel testing of photonic integrated circuits. The probes are fabricated in an oxynitride platform and test demonstrations were carried out of edge-coupled indium-phosphide based photonic integrated circuits (PICs). Thirty-two optical parallel connections are simultaneously, passively aligned between the probe and the PIC by means of integrated guiding channels. The initial placement tolerance is more than 4 <inline-formula><tex-math notation="LaTeX">${\mu }\rm{m}$</tex-math></inline-formula> to give a passive alignment with an optical power variation of less than 1 dB. Multi-port loop-back optical power measurements are reported and the wavelength-dependent net modal gain of integrated semiconductor optical amplifiers was measured to further validate the concept. |
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| ISSN: | 1943-0655 |