Research on the differences of RF port simulation and test of X-band power device package
This paper discussed research on the differences of RF Port simulation and test of X-band power device package which was based on probe test method. After optimizing it with simulation software, samples are produced through HTCC process line, the result of testing the port with GSG probe is much lar...
Saved in:
Main Authors: | Yan Huizeng, Shi Mengqiao, Zhou Hao, Chen Huanbei |
---|---|
Format: | Article |
Language: | Chinese |
Published: |
National Computer System Engineering Research Institute of China
2022-04-01
|
Series: | Dianzi Jishu Yingyong |
Subjects: | |
Online Access: | http://www.chinaaet.com/article/3000148330 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Antenna-in-Package Using IC-Embedded Metal Fan-Out Wafer-Level Package for D-Band Applications
by: Ju-Yong Lee, et al.
Published: (2025-01-01) -
A dual-band circular polarized CPW fed low-profile antenna for WLAN and X-band applications
by: Sridhar P, et al.
Published: (2025-09-01) -
A X-Band Integrated Passive Device Structure Based on TMV-Embedded FOWLP
by: Jiajie Yang, et al.
Published: (2025-06-01) -
Band Tailoring Enabled Perovskite Devices for X‐Ray to Near‐Infrared Photodetection
by: Yi‐Chu He, et al.
Published: (2025-03-01) -
Electron beam x-ray microanalysis
by: Heinrich, Kurt F. J.
Published: (1981)