Influence of Reflow Cycles of the Pb–Free/Pb Hybrid Assembly Process on the IMCs Growth Interface of Micro-Solder Joints

Influence of Reflow Cycles of the Pb–Free/Pb Hybrid Assembly Process on the IMCs Growth Interface of Micro-Solder Joints

Under the dual impetus of environmental regulations and reliability requirements, the Pb–free/Pb hybrid assembly process in aerospace-grade ball grid array (BGA) components has become an unavoidable industrial imperative. However, constrained process compatibility during single or multiple reflow pr...

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Bibliographic Details
Main Authors: Xinyuan He, Qi Zhang, Qiming Cui, Yifan Bai, Lincheng Fu, Zicong Zhao, Chuanhang Zou, Yong Wang
Format: Article
Language:English
Published: MDPI AG 2025-05-01
Series:Crystals
Subjects:
micro-solder joint
Pb–free/Pb hybrid assembly process
reflow cycles
interfacial reaction
process optimization
Online Access:https://www.mdpi.com/2073-4352/15/6/516
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