APA (7th ed.) Citation

He, X., Zhang, Q., Cui, Q., Bai, Y., Fu, L., Zhao, Z., . . . Wang, Y. (2025). Influence of Reflow Cycles of the Pb–Free/Pb Hybrid Assembly Process on the IMCs Growth Interface of Micro-Solder Joints. MDPI AG.

Chicago Style (17th ed.) Citation

He, Xinyuan, Qi Zhang, Qiming Cui, Yifan Bai, Lincheng Fu, Zicong Zhao, Chuanhang Zou, and Yong Wang. Influence of Reflow Cycles of the Pb–Free/Pb Hybrid Assembly Process on the IMCs Growth Interface of Micro-Solder Joints. MDPI AG, 2025.

MLA (9th ed.) Citation

He, Xinyuan, et al. Influence of Reflow Cycles of the Pb–Free/Pb Hybrid Assembly Process on the IMCs Growth Interface of Micro-Solder Joints. MDPI AG, 2025.