Rapid thermal treatment robotics unit for creation of electronic equipment devices

The design specific features of the rapid thermal treatment automated unit for silicon wafers with the diameter of 100 mm are described. For preheating the unit uses the halogen lamps with a tungsten spiral of KGT 220-2000-3 in the quantity of 12 pieces, which ensure the wafer heating up to 1200 ºC...

Full description

Saved in:
Bibliographic Details
Main Authors: V. A. Saladukha, V. A. Pilipenko, V. P. Yakovlev
Format: Article
Language:Russian
Published: Educational institution «Belarusian State University of Informatics and Radioelectronics» 2019-06-01
Series:Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki
Subjects:
Online Access:https://doklady.bsuir.by/jour/article/view/1099
Tags: Add Tag
No Tags, Be the first to tag this record!