Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias
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| Main Author: | |
|---|---|
| Format: | Electronic Book Chapter |
| Language: | English |
| Published: |
IntechOpen
2012
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| Subjects: | |
| Online Access: | https://www.intechopen.com/chapters/35384 |
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| _version_ | 1839566116007968768 |
|---|---|
| author | Raynal, Frederic |
| author_facet | Raynal, Frederic |
| author_sort | Raynal, Frederic |
| collection | InTech Open eBooks |
| description | None |
| doi_str_mv | 10.5772/33948 |
| first_indexed | 2025-08-04T22:35:58Z |
| format | Electronic Book Chapter |
| fullrecord | <oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd"><identifier>InTech-35384</identifier><datestamp>2012-04-11</datestamp>
<dc:title>Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias</dc:title>
<dc:creator>Frederic Raynal</dc:creator>
<dc:subject>Physical Sciences, Engineering and Technology</dc:subject>
<dc:description>None</dc:description>
<dc:publisher>IntechOpen</dc:publisher>
<dc:date>2012-04-11</dc:date>
<dc:type>Chapter, Part Of Book</dc:type>
<dc:identifier>https://www.intechopen.com/chapters/35384</dc:identifier>
<dc:identifier>doi:10.5772/33948</dc:identifier>
<dc:language>en</dc:language>
<dc:relation>ISBN:978-953-51-0471-1</dc:relation>
<dc:rights>https://creativecommons.org/licenses/by/3.0/</dc:rights>
<dc:source>https://www.intechopen.com/books/1455 ; Electroplating</dc:source>
</oai_dc:dc> |
| id | InTech-35384 |
| institution | Matheson Library |
| isbn | 978-953-51-0471-1 |
| language | English |
| last_indexed | 2025-08-04T22:35:58Z |
| publishDate | 2012 |
| publisher | IntechOpen |
| record_format | intech |
| spelling | InTech-353842012-04-11 Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias Frederic Raynal Physical Sciences, Engineering and Technology None IntechOpen 2012-04-11 Chapter, Part Of Book https://www.intechopen.com/chapters/35384 doi:10.5772/33948 en ISBN:978-953-51-0471-1 https://creativecommons.org/licenses/by/3.0/ https://www.intechopen.com/books/1455 ; Electroplating |
| spellingShingle | Physical Sciences, Engineering and Technology Raynal, Frederic Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias |
| title | Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias |
| title_full | Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias |
| title_fullStr | Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias |
| title_full_unstemmed | Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias |
| title_short | Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias |
| title_sort | integration of electrografted layers for the metallization of deep through silicon vias |
| topic | Physical Sciences, Engineering and Technology |
| url | https://www.intechopen.com/chapters/35384 |
| work_keys_str_mv | AT raynalfrederic integrationofelectrograftedlayersforthemetallizationofdeepthroughsiliconvias |