The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials

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The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials

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Bibliographic Details
Main Authors:	Cook, Daniel J., Yeager, Matthew S., Chakraborty, Shamik, Whiting, Donald M., Cheng, Boyle C.
Format:	Electronic Book Chapter
Language:	English
Published:	IntechOpen 2012
Subjects:	Physical Sciences, Engineering and Technology
Online Access:	https://www.intechopen.com/chapters/34072
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