The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials
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| Main Authors: | , , , , |
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| Format: | Electronic Book Chapter |
| Language: | English |
| Published: |
IntechOpen
2012
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| Subjects: | |
| Online Access: | https://www.intechopen.com/chapters/34072 |
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| _version_ | 1839566426469302272 |
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| author | Cook, Daniel J. Yeager, Matthew S. Chakraborty, Shamik Whiting, Donald M. Cheng, Boyle C. |
| author_facet | Cook, Daniel J. Yeager, Matthew S. Chakraborty, Shamik Whiting, Donald M. Cheng, Boyle C. |
| author_sort | Cook, Daniel J. |
| collection | InTech Open eBooks |
| description | None |
| doi_str_mv | 10.5772/36742 |
| first_indexed | 2025-08-04T22:40:54Z |
| format | Electronic Book Chapter |
| fullrecord | <oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd"><identifier>InTech-34072</identifier><datestamp>2012-03-28</datestamp>
<dc:title>The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials</dc:title>
<dc:creator>Daniel J. Cook</dc:creator>
<dc:creator>Matthew S. Yeager</dc:creator>
<dc:creator>Shamik Chakraborty</dc:creator>
<dc:creator>Donald M. Whiting</dc:creator>
<dc:creator>Boyle C. Cheng</dc:creator>
<dc:subject>Physical Sciences, Engineering and Technology</dc:subject>
<dc:description>None</dc:description>
<dc:publisher>IntechOpen</dc:publisher>
<dc:date>2012-03-28</dc:date>
<dc:type>Chapter, Part Of Book</dc:type>
<dc:identifier>https://www.intechopen.com/chapters/34072</dc:identifier>
<dc:identifier>doi:10.5772/36742</dc:identifier>
<dc:language>en</dc:language>
<dc:relation>ISBN:978-953-51-0346-2</dc:relation>
<dc:rights>https://creativecommons.org/licenses/by/3.0/</dc:rights>
<dc:source>https://www.intechopen.com/books/1573 ; Thermoplastic Elastomers</dc:source>
</oai_dc:dc> |
| id | InTech-34072 |
| institution | Matheson Library |
| isbn | 978-953-51-0346-2 |
| language | English |
| last_indexed | 2025-08-04T22:40:54Z |
| publishDate | 2012 |
| publisher | IntechOpen |
| record_format | intech |
| spelling | InTech-340722012-03-28 The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials Daniel J. Cook Matthew S. Yeager Shamik Chakraborty Donald M. Whiting Boyle C. Cheng Physical Sciences, Engineering and Technology None IntechOpen 2012-03-28 Chapter, Part Of Book https://www.intechopen.com/chapters/34072 doi:10.5772/36742 en ISBN:978-953-51-0346-2 https://creativecommons.org/licenses/by/3.0/ https://www.intechopen.com/books/1573 ; Thermoplastic Elastomers |
| spellingShingle | Physical Sciences, Engineering and Technology Cook, Daniel J. Yeager, Matthew S. Chakraborty, Shamik Whiting, Donald M. Cheng, Boyle C. The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials |
| title | The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials |
| title_full | The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials |
| title_fullStr | The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials |
| title_full_unstemmed | The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials |
| title_short | The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials |
| title_sort | performance envelope of spinal implants utilizing thermoplastic materials |
| topic | Physical Sciences, Engineering and Technology |
| url | https://www.intechopen.com/chapters/34072 |
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