The Performance Envelope of Spinal Implants Utilizing Thermoplastic Materials

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Bibliographic Details
Main Authors: Cook, Daniel J., Yeager, Matthew S., Chakraborty, Shamik, Whiting, Donald M., Cheng, Boyle C.
Format: Electronic Book Chapter
Language:English
Published: IntechOpen 2012
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Online Access:https://www.intechopen.com/chapters/34072
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Description
Summary:None
ISBN:978-953-51-0346-2
DOI:10.5772/36742