Insert Molding Process Employing Vapour Chamber

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Insert Molding Process Employing Vapour Chamber

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Bibliographic Details
Main Authors:	Wang, Jung-Chang, Chang, Tien-Li, Lee, Ya-Wei
Format:	Electronic Book Chapter
Language:	English
Published:	IntechOpen 2012
Subjects:	Physical Sciences, Engineering and Technology
Online Access:	https://www.intechopen.com/chapters/33651
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