Insert Molding Process Employing Vapour Chamber
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| Main Authors: | , , |
|---|---|
| Format: | Electronic Book Chapter |
| Language: | English |
| Published: |
IntechOpen
2012
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| Subjects: | |
| Online Access: | https://www.intechopen.com/chapters/33651 |
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| _version_ | 1839567033373556736 |
|---|---|
| author | Wang, Jung-Chang Chang, Tien-Li Lee, Ya-Wei |
| author_facet | Wang, Jung-Chang Chang, Tien-Li Lee, Ya-Wei |
| author_sort | Wang, Jung-Chang |
| collection | InTech Open eBooks |
| description | None |
| doi_str_mv | 10.5772/35621 |
| first_indexed | 2025-08-04T22:50:32Z |
| format | Electronic Book Chapter |
| fullrecord | <oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd"><identifier>InTech-33651</identifier><datestamp>2012-03-23</datestamp>
<dc:title>Insert Molding Process Employing Vapour Chamber</dc:title>
<dc:creator>Jung-Chang Wang</dc:creator>
<dc:creator>Tien-Li Chang</dc:creator>
<dc:creator>Ya-Wei Lee</dc:creator>
<dc:subject>Physical Sciences, Engineering and Technology</dc:subject>
<dc:description>None</dc:description>
<dc:publisher>IntechOpen</dc:publisher>
<dc:date>2012-03-23</dc:date>
<dc:type>Chapter, Part Of Book</dc:type>
<dc:identifier>https://www.intechopen.com/chapters/33651</dc:identifier>
<dc:identifier>doi:10.5772/35621</dc:identifier>
<dc:language>en</dc:language>
<dc:relation>ISBN:978-953-51-0297-7</dc:relation>
<dc:rights>https://creativecommons.org/licenses/by/3.0/</dc:rights>
<dc:source>https://www.intechopen.com/books/1869 ; Some Critical Issues for Injection Molding</dc:source>
</oai_dc:dc> |
| id | InTech-33651 |
| institution | Matheson Library |
| isbn | 978-953-51-0297-7 |
| language | English |
| last_indexed | 2025-08-04T22:50:32Z |
| publishDate | 2012 |
| publisher | IntechOpen |
| record_format | intech |
| spelling | InTech-336512012-03-23 Insert Molding Process Employing Vapour Chamber Jung-Chang Wang Tien-Li Chang Ya-Wei Lee Physical Sciences, Engineering and Technology None IntechOpen 2012-03-23 Chapter, Part Of Book https://www.intechopen.com/chapters/33651 doi:10.5772/35621 en ISBN:978-953-51-0297-7 https://creativecommons.org/licenses/by/3.0/ https://www.intechopen.com/books/1869 ; Some Critical Issues for Injection Molding |
| spellingShingle | Physical Sciences, Engineering and Technology Wang, Jung-Chang Chang, Tien-Li Lee, Ya-Wei Insert Molding Process Employing Vapour Chamber |
| title | Insert Molding Process Employing Vapour Chamber |
| title_full | Insert Molding Process Employing Vapour Chamber |
| title_fullStr | Insert Molding Process Employing Vapour Chamber |
| title_full_unstemmed | Insert Molding Process Employing Vapour Chamber |
| title_short | Insert Molding Process Employing Vapour Chamber |
| title_sort | insert molding process employing vapour chamber |
| topic | Physical Sciences, Engineering and Technology |
| url | https://www.intechopen.com/chapters/33651 |
| work_keys_str_mv | AT wangjungchang insertmoldingprocessemployingvapourchamber AT changtienli insertmoldingprocessemployingvapourchamber AT leeyawei insertmoldingprocessemployingvapourchamber |