The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections

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The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections

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Bibliographic Details
Main Authors:	Mattila, Toni T., Kivilahti, Jorma K.
Format:	Electronic Book Chapter
Language:	English
Published:	IntechOpen 2012
Subjects:	Physical Sciences, Engineering and Technology
Online Access:	https://www.intechopen.com/chapters/30904
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