The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections
None
Saved in:
| Main Authors: | , |
|---|---|
| Format: | Electronic Book Chapter |
| Language: | English |
| Published: |
IntechOpen
2012
|
| Subjects: | |
| Online Access: | https://www.intechopen.com/chapters/30904 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1839566347724390400 |
|---|---|
| author | Mattila, Toni T. Kivilahti, Jorma K. |
| author_facet | Mattila, Toni T. Kivilahti, Jorma K. |
| author_sort | Mattila, Toni T. |
| collection | InTech Open eBooks |
| description | None |
| doi_str_mv | 10.5772/37899 |
| first_indexed | 2025-08-04T22:39:39Z |
| format | Electronic Book Chapter |
| fullrecord | <oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd"><identifier>InTech-30904</identifier><datestamp>2012-03-07</datestamp>
<dc:title>The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections</dc:title>
<dc:creator>Toni T. Mattila</dc:creator>
<dc:creator>Jorma K. Kivilahti</dc:creator>
<dc:subject>Physical Sciences, Engineering and Technology</dc:subject>
<dc:description>None</dc:description>
<dc:publisher>IntechOpen</dc:publisher>
<dc:date>2012-03-07</dc:date>
<dc:type>Chapter, Part Of Book</dc:type>
<dc:identifier>https://www.intechopen.com/chapters/30904</dc:identifier>
<dc:identifier>doi:10.5772/37899</dc:identifier>
<dc:language>en</dc:language>
<dc:relation>ISBN:978-953-51-0122-2</dc:relation>
<dc:rights>https://creativecommons.org/licenses/by/3.0/</dc:rights>
<dc:source>https://www.intechopen.com/books/1563 ; Recrystallization</dc:source>
</oai_dc:dc> |
| id | InTech-30904 |
| institution | Matheson Library |
| isbn | 978-953-51-0122-2 |
| language | English |
| last_indexed | 2025-08-04T22:39:39Z |
| publishDate | 2012 |
| publisher | IntechOpen |
| record_format | intech |
| spelling | InTech-309042012-03-07 The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections Toni T. Mattila Jorma K. Kivilahti Physical Sciences, Engineering and Technology None IntechOpen 2012-03-07 Chapter, Part Of Book https://www.intechopen.com/chapters/30904 doi:10.5772/37899 en ISBN:978-953-51-0122-2 https://creativecommons.org/licenses/by/3.0/ https://www.intechopen.com/books/1563 ; Recrystallization |
| spellingShingle | Physical Sciences, Engineering and Technology Mattila, Toni T. Kivilahti, Jorma K. The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections |
| title | The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections |
| title_full | The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections |
| title_fullStr | The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections |
| title_full_unstemmed | The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections |
| title_short | The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections |
| title_sort | failure mechanism of recrystallization assisted cracking of solder interconnections |
| topic | Physical Sciences, Engineering and Technology |
| url | https://www.intechopen.com/chapters/30904 |
| work_keys_str_mv | AT mattilatonit thefailuremechanismofrecrystallizationassistedcrackingofsolderinterconnections AT kivilahtijormak thefailuremechanismofrecrystallizationassistedcrackingofsolderinterconnections AT mattilatonit failuremechanismofrecrystallizationassistedcrackingofsolderinterconnections AT kivilahtijormak failuremechanismofrecrystallizationassistedcrackingofsolderinterconnections |