APA (7th ed.) Citation

Mattila, T. T., & Kivilahti, J. K. (2012). The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections. IntechOpen. https://doi.org/10.5772/37899

Chicago Style (17th ed.) Citation

Mattila, Toni T., and Jorma K. Kivilahti. The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections. IntechOpen, 2012. https://doi.org/10.5772/37899.

MLA (9th ed.) Citation

Mattila, Toni T., and Jorma K. Kivilahti. The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections. IntechOpen, 2012. https://doi.org/10.5772/37899.

Warning: These citations may not always be 100% accurate.