Dielectrics for High Temperature SiC Device Insulation: Review of New Polymeric and Ceramic Materials

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Dielectrics for High Temperature SiC Device Insulation: Review of New Polymeric and Ceramic Materials

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Bibliographic Details
Main Authors:	Diaham, Sombel, Locatelli, Marie-Laure, Valdez-Nava, Zarel
Format:	Electronic Book Chapter
Language:	English
Published:	IntechOpen 2011
Subjects:	Physical Sciences, Engineering and Technology
Online Access:	https://www.intechopen.com/chapters/21153
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