A Closed-Form Solution for the Transient Heat and Moisture Diffusion in a Double-Layer Plate

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A Closed-Form Solution for the Transient Heat and Moisture Diffusion in a Double-Layer Plate

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Bibliographische Detailangaben
1. Verfasser:	Chiba, Ryoichi
Format:	Elektronisch Buchkapitel
Sprache:	Englisch
Veröffentlicht:	IntechOpen 2011
Schlagworte:	Physical Sciences, Engineering and Technology
Online-Zugang:	https://www.intechopen.com/chapters/13431
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

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