Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips
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| Main Authors: | , |
|---|---|
| Format: | Electronic Book Chapter |
| Language: | English |
| Published: |
IntechOpen
2011
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| Subjects: | |
| Online Access: | https://www.intechopen.com/chapters/13185 |
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| _version_ | 1839565617305223168 |
|---|---|
| author | Wei, Jinjia Xue, Yanfang |
| author_facet | Wei, Jinjia Xue, Yanfang |
| author_sort | Wei, Jinjia |
| collection | InTech Open eBooks |
| description | None |
| doi_str_mv | 10.5772/14466 |
| first_indexed | 2025-08-04T22:28:02Z |
| format | Electronic Book Chapter |
| fullrecord | <oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd"><identifier>InTech-13185</identifier><datestamp>2011-01-28</datestamp>
<dc:title>Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips</dc:title>
<dc:creator>Jinjia Wei</dc:creator>
<dc:creator>Yanfang Xue</dc:creator>
<dc:subject>Physical Sciences, Engineering and Technology</dc:subject>
<dc:description>None</dc:description>
<dc:publisher>IntechOpen</dc:publisher>
<dc:date>2011-01-28</dc:date>
<dc:type>Chapter, Part Of Book</dc:type>
<dc:identifier>https://www.intechopen.com/chapters/13185</dc:identifier>
<dc:identifier>doi:10.5772/14466</dc:identifier>
<dc:language>en</dc:language>
<dc:relation>ISBN:978-953-307-226-5</dc:relation>
<dc:rights>https://creativecommons.org/licenses/by-nc-sa/3.0/</dc:rights>
<dc:source>https://www.intechopen.com/books/1287 ; Heat Transfer - Theoretical Analysis, Experimental Investigations and Industrial Systems</dc:source>
</oai_dc:dc> |
| id | InTech-13185 |
| institution | Matheson Library |
| isbn | 978-953-307-226-5 |
| language | English |
| last_indexed | 2025-08-04T22:28:02Z |
| publishDate | 2011 |
| publisher | IntechOpen |
| record_format | intech |
| spelling | InTech-131852011-01-28 Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips Jinjia Wei Yanfang Xue Physical Sciences, Engineering and Technology None IntechOpen 2011-01-28 Chapter, Part Of Book https://www.intechopen.com/chapters/13185 doi:10.5772/14466 en ISBN:978-953-307-226-5 https://creativecommons.org/licenses/by-nc-sa/3.0/ https://www.intechopen.com/books/1287 ; Heat Transfer - Theoretical Analysis, Experimental Investigations and Industrial Systems |
| spellingShingle | Physical Sciences, Engineering and Technology Wei, Jinjia Xue, Yanfang Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips |
| title | Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips |
| title_full | Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips |
| title_fullStr | Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips |
| title_full_unstemmed | Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips |
| title_short | Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips |
| title_sort | enhanced boiling heat transfer from micro pin finned silicon chips |
| topic | Physical Sciences, Engineering and Technology |
| url | https://www.intechopen.com/chapters/13185 |
| work_keys_str_mv | AT weijinjia enhancedboilingheattransferfrommicropinfinnedsiliconchips AT xueyanfang enhancedboilingheattransferfrommicropinfinnedsiliconchips |