Wei, J., & Xue, Y. (2011). Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips. IntechOpen. https://doi.org/10.5772/14466
Chicago Style (17th ed.) CitationWei, Jinjia, and Yanfang Xue. Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips. IntechOpen, 2011. https://doi.org/10.5772/14466.
MLA (9th ed.) CitationWei, Jinjia, and Yanfang Xue. Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips. IntechOpen, 2011. https://doi.org/10.5772/14466.
Warning: These citations may not always be 100% accurate.