Soldering in electronics

QR Code

Soldering in electronics

Saved in:

Bibliographic Details
Main Author:	Klein Wassink, R. J.
Format:	Book
Language:	English
Published:	Ayr Electrochemical Publications 1984
Subjects:	Joints (Engineering) Solder and soldering
Tags:	Add Tag No Tags, Be the first to tag this record!

Similar Items

Soldering in electronics assembly /
by: Judd, Mike
Published: (1992)

Soldering and brazing technology, part one : soldiering /
by: Churchill, S. Collard
Published: (1963)

PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS
by: A. A. CHULARIS, et al.
Published: (2010-04-01)

Development of a soft-soldering system for aluminum
by: Falke, W. L. (Wilbert L.)
Published: (1983)

The basics of soldering /
by: Rahn, Armin
Published: (1993)

Capillary joining brazing and soft-soldering
by: Thwaites, C. J. (Colin John), 1927-
Published: (1982)

The Power Electronic Soldering Process: An Evaluation of Soldering Materials and Basic Soldering Principles
by: Marek Chnapko, et al.
Published: (2025-07-01)

Effect of copper on interfacial reaction and microstructure of soldering on aluminum substrate
by: Jiahui Li, et al.
Published: (2025-07-01)

Characterization and Failure Analysis of Solder Joints in Ball Grid Array (BGA) Components Using Cross-Section, Dye and Pry, and Microstructural Etching Techniques
by: G.F.R.C. Pádua, et al.
Published: (2025-06-01)

Handbook of lead-free solder technology for microelectronic assemblies /
Published: (2004)

The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints
by: SUN Feng-lian, et al.
Published: (2021-12-01)

Reliability optimization of solder joints in large-sized COTS devices based on solder mask layer design
by: Geng LI, et al.
Published: (2025-05-01)

Influence of Reflow Cycles of the Pb–Free/Pb Hybrid Assembly Process on the IMCs Growth Interface of Micro-Solder Joints
by: Xinyuan He, et al.
Published: (2025-05-01)

Complex processing of tin-lead dross into solders and ligatures
by: B. M. Nemenenok, et al.
Published: (2020-04-01)

Temperature- and stress-dependent creep behavior of SAC305 solder alloy through tensile characterization and CPFE simulation
by: Yuhong Ma, et al.
Published: (2025-09-01)

Numerical simulations of the influence of thermal cycling parameters on the mechanical response of SAC305 interconnects
by: Gharaibeh Mohammad A.
Published: (2025-06-01)

Sn–31Bi–19In alloy: A golden ratio design for exceptional elongation, high strength, and low-temperature soldering
by: Yu-An Shen, et al.
Published: (2025-07-01)

Numerical Simulation of Thermal Cycling and Vibration Effects on Solder Layer Reliability in High-Power Diode Lasers for Space Applications
by: Lei Cheng, et al.
Published: (2025-06-01)

Advanced tin recycling technology
by: B. M. Nemenenok, et al.
Published: (2024-09-01)

A BGA Solder Ball Surface Treatment Agent and Its Performance Evaluation
by: FANG Shu, ZHU Jun - nan, TAN Run - qiu, HUANG Jin - xin
Published: (2021-10-01)

Improving the thermal properties of the device in the process of forming a contact with the collector region of a silicon transistor
by: E. Kazalieva, et al.
Published: (2022-11-01)

Quantitative Assessment of Soldering-Induced PM<sub>2.5</sub> Exposure Using a Distributed Sensor Network in Instructional Laboratory Settings
by: Ian M. Kinsella, et al.
Published: (2025-06-01)

ESTIMATION OF THERMAL PARAMETERS OF POWER BIPOLAR TRANSISTORS BY THE METHOD OF THERMAL RELAXATION DIFFERENTIAL SPECTROMETRY
by: V. S. Niss, et al.
Published: (2015-12-01)

How the Risk of Tin Whiskers Affects Design Decisions: Is the Aerospace and Defense Approach to Tin Whiskers the Right Approach
by: Michael Pecht, et al.
Published: (2025-01-01)

Method for forming a titanium-germanium contact layer for thermostabilization of transistors
by: T. A. Ismailov, et al.
Published: (2021-01-01)

Microfocus X-ray Tubes
by: V. B. Bessonov
Published: (2021-11-01)

Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging
by: Tsao, L.C.
Published: (2012)

Recovering gold from scrap electronic solders by drossing /
by: Ferrell, Edward F.
Published: (1976)

The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections
by: Mattila, Toni T., et al.
Published: (2012)

Slip joints under concrete roof slabs /
by: Schubert, T. J.
Published: (1983)

Performance of sealant-concrete joints in wet conditions : results of a laboratory testing programme research project RP355: phase 2, stage 3 volume 2: schedules of detailed test results /
by: Aubrey, D. W.
Published: (1993)

Performance of sealant-concrete joints in wet conditions : results of a laboratory testing programme volume 1: main results and discussion /
by: Aubrey, D. W.
Published: (1992)

Design of mechanical joints /
by: Blake, Alexander
Published: (1985)

Structural fasteners and their application
by: Boston, R.M
Published: (1978)

Couplings and joints : design, selection, and application /
by: Mancuso, Jon R., 1943-
Published: (1986)

Steel beam-to-column building connections /
Published: (1988)

Introduction to the biomechanics of joints and joint replacement /
Published: (1981)

Design and performance of structural timber joints : [papers from the seminar] /
Published: (1986)

Mechanobiological Assessment of TMJ Disc Surfaces: Nanoindentation and Transmission Electron Microscopy
by: Cassandra M. Juran, et al.
Published: (2015-12-01)

Handbook of precision engineering /
Published: (1972)