Handbook of lead-free solder technology for microelectronic assemblies /
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning mic...
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| Other Authors: | , |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York :
Marcel Dekker,
c2004.
|
| Series: | Mechanical engineering ;
170 |
| Subjects: | |
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| 020 | |a 0824748700 (hardback) | ||
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| 245 | 0 | 0 | |a Handbook of lead-free solder technology for microelectronic assemblies / |c edited by Karl J. Puttlitz, Kathleen A. Stalter. |
| 260 | |a New York : |b Marcel Dekker, |c c2004. | ||
| 300 | |a xi, 1026 pages : |b illustration ; |c 27 cm. | ||
| 490 | 1 | |a Mechanical engineering ; |v 170 | |
| 504 | |a Includes bibliographical references and index. | ||
| 520 | |a This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of altern. | ||
| 650 | 0 | |a Electronic packaging. |9 2560 | |
| 650 | 0 | |a Solder and soldering. |9 2561 | |
| 650 | 0 | |a Microelectronics. |9 2562 | |
| 650 | 0 | |a Green electronics. |9 2563 | |
| 650 | 0 | |a Environmental protection. |9 1468 | |
| 650 | 0 | |a Lead-free electronics manufacturing processes. |9 2564 | |
| 700 | 1 | |a Puttlitz, Karl J. |9 2565 | |
| 700 | 1 | |a Stalter, Kathleen A. |9 2566 | |
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