Handbook of lead-free solder technology for microelectronic assemblies /
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning mic...
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| Other Authors: | , |
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| Format: | Book |
| Language: | English |
| Published: |
New York :
Marcel Dekker,
c2004.
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| Series: | Mechanical engineering ;
170 |
| Subjects: | |
| Tags: |
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| Summary: | This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of altern. |
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| Physical Description: | xi, 1026 pages : illustration ; 27 cm. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 0824748700 (hardback) |