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    Semiconductor Wafer Flatness and Thickness Measurement Using Frequency Scanning Interferometry Technology

    Semiconductor Wafer Flatness and Thickness Measurement Using Frequency Scanning Interferometry Technology by Weisheng Cheng, Zexiao Li, Xuanzong Wu, Shuangxiong Yin, Bo Zhang, Xiaodong Zhang

    Published 2025-06-01

    Silicon (Si) and silicon carbide (SiC) are second- and third-generation semiconductor materials with excellent properties that are particularly suitable for applications in scenarios such as high temperature, high voltage, and high frequency. Si/SiC wafers face warpage and bending problems during pr...

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