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    Interconnection mechanism and strengthening behavior of nano-silver sintered joints for silicon carbide power module packaging: A combined EBSD and nanoindentation study

    Interconnection mechanism and strengthening behavior of nano-silver sintered joints for silicon carbide power module packaging: A combined EBSD and nanoindentation study by Chao Gu, Xiao Hu, Xuyang Yan, Wei Chen, Junwei Chen, Kai Lu, Tao Wang, Guoqi Zhang, Jiajie Fan

    Published 2025-09-01
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