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    Temperature-Insensitive Cryogenic Packaging for Thin-Film Lithium Niobate Photonic Chips

    Temperature-Insensitive Cryogenic Packaging for Thin-Film Lithium Niobate Photonic Chips by Yongteng Wang, Yuxin Ma, Xiaojie Wang, Ziwei Zhao, Yongmin Li, Tianshu Yang

    Published 2025-05-01

    As photonic integrated circuits (PICs) gain prominence in quantum communication and quantum computation, the development of efficient and stable cryogenic packaging technologies becomes paramount. This paper presents a robust and scalable cryogenic packaging method for thin-film lithium niobate (TFL...

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