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    Comprehensive enhancement of mechanical strength, thermal conductivity, and oxidation resistance of W/Cu diffusion bonding joint via heterogeneous interface configuration theoretical design

    Comprehensive enhancement of mechanical strength, thermal conductivity, and oxidation resistance of W/Cu diffusion bonding joint via heterogeneous interface configuration theoretic... by Zida Wang, Jinghao Xu, Qi Wu, Shuwen Shang, Wei Shao, Jihua Huang, Shuhai Chen, Zheng Ye, Wanli Wang, Jian Yang

    Published 2025-07-01
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