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    Design of DC-60 GHz silicon based vertical interconnection structure

    Design of DC-60 GHz silicon based vertical interconnection structure by You Yuejuan, Liu Dexi, Liu Yawei, Shi Lei

    Published 2022-01-01

    A vertical interconnection structure based on a stack of multi-layer silicon interposer boards is designed. The simulation results of the vertical interconnection structure of the two interlayer structure not considering and considering the SiO2 layer on the silicon surface were compared in the DC-6...

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