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    Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre

    Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre by How Yuan Hwang, Jun Su Lee, Tae Joon Seok, Alex Forencich, Hannah R. Grant, Dylan Knutson, Niels Quack, Sangyoon Han, Richard S. Muller, George C. Papen, Ming C. Wu, Peter O'Brien

    Published 2017-01-01
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