Search Results - Jiho Kang

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    Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration

    Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration by Hayato Kitagawa, Ryosuke Sato, Sodai Ebiko, Atsushi Nagata, Chiwoo Ahn, Yeounsoo Kim, Jiho Kang, Akira Uedono, Fumihiro Inoue

    Published 2025-06-01
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