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    Ceramic based 3D integration technology of integrated navigation microsystem

    Ceramic based 3D integration technology of integrated navigation microsystem by Shen Shijun, He Yilei, Wang Jinhua, Zhuang Yonghe

    Published 2025-04-01

    In order to solve the problem of large volume and weight of high-precision integrated navigation system, a new 3D micro system packaging structure is proposed based on System in Package(SiP) technology such as multi-layer ceramic substrate, high-density wiring and 3D assembly. Using SIP processes su...

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