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    Investigation of grain growth mechanisms in nanocrystalline Cu for Cu direct bonding

    Investigation of grain growth mechanisms in nanocrystalline Cu for Cu direct bonding by Shichen Xie, Ziting Ye, Zishan Xiong, Fuxin Du, Songpeng Zhao, K.N. Tu, Yuzheng Guo, Sheng Liu, Yingxia Liu

    Published 2025-07-01
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