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    Temperature- and stress-dependent creep behavior of SAC305 solder alloy through tensile characterization and CPFE simulation

    Temperature- and stress-dependent creep behavior of SAC305 solder alloy through tensile characterization and CPFE simulation by Yuhong Ma, Dan Zhao, Erqiang Liu, Xuexia Yang, Gesheng Xiao, Xuefeng Shu

    Published 2025-09-01
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