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    Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre

    Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre von How Yuan Hwang, Jun Su Lee, Tae Joon Seok, Alex Forencich, Hannah R. Grant, Dylan Knutson, Niels Quack, Sangyoon Han, Richard S. Muller, George C. Papen, Ming C. Wu, Peter O'Brien

    Veröffentlicht 2017-01-01

    We report on the flip chip packaging of Micro-Electro-Mechanical System (MEMS)-based digital silicon photonic switching device and the characterization results of 12 &#x00D7; 12 switching ports. The challenges in packaging N<sup> 2</sup> electrical and 2N optical interconnections are...

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