検索結果 - Dylan Knutson
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Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre
出版事項 2017-01-01全文の入手We report on the flip chip packaging of Micro-Electro-Mechanical System (MEMS)-based digital silicon photonic switching device and the characterization results of 12 × 12 switching ports. The challenges in packaging N<sup> 2</sup> electrical and 2N optical interconnections are...
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