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    An integrated nanoindentation-finite element analysis approach for fracture toughness characterization and yield strength prediction in semiconductor thin films

    An integrated nanoindentation-finite element analysis approach for fracture toughness characterization and yield strength prediction in semiconductor thin films by Dao Kun Lim, Derik Rudd, Kian Guan Khoo, Fa Xing Che, Venkata Rama Satya Pradeep Vempaty, Wen How Sim, Harjashan Veer Singh, Wentao Yan, Yeow Kheng Lim

    Published 2025-09-01
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